Right Angle Myriad JR With Value Swivel Articulating Arm

Our proprietary three-layer tape provides non-sparking surfaces on both the inside and the outside. A conductive grid is buried between two static dissipating copolymer substrates that will not shed, crack, chip or rub off.

Meets or exceeds requirements of ANSI ESD-S20.20.

Applications:

Use ESD symbols for ESD awareness
Sealing ESD packaging/containers
For applications requiring EMI Shielding
Using a grounded tape despenser, voltage generated by unrolling will effectively be reduced to zero.
Secure (bundle) IC DIP tubes
Three-layer tape provides non-sparking surfaces on both the inside and the outside.
A conductive grid is buried between two static dissipating copolymer substrates that will not shed, crack, chip or rub off.
Available on 3″ cores.